Download e-book for kindle: 3D Microelectronic Packaging: From Fundamentals to by Yan Li,Deepak Goyal

By Yan Li,Deepak Goyal

ISBN-10: 3319445847

ISBN-13: 9783319445847

This quantity presents a accomplished reference for graduate scholars and pros in either academia and at the basics, processing info, and functions of 3D microelectronic packaging, an development for destiny microelectronic applications. Chapters written via specialists conceal the newest learn effects and development within the following parts: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complicated fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. quite a few pictures, tables, and didactic schematics are incorporated all through. This crucial quantity equips readers with an in-depth knowing of all points of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability issues, universal disasters, constructing components, and destiny demanding situations, delivering insights into key components for destiny examine and development. 

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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li,Deepak Goyal


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